Thermal Test System
SANWOOD Thermal Test System specifically designed for core components such as semiconductors, chips, and sensors. By rapidly cycling between extreme temperatures, it triggers potential failures in the shortest possible time to validate material and solder joint reliability. Meeting stringent standards like JESD22-A104 and MIL-STD, it serves as critical equipment for accelerating R&D, screening defects, and enhancing product durability.
Thermal Test System
SANWOOD Thermal Test System rapidly exposes latent defects in semiconductors, chips, and communication devices through extreme temperature cycling. Designed to detect chemical and physical failures in the shortest time, it accelerates R&D and reduces time-to-market.
Advantages Of Sanwood Test Chamber
Sanwood Thermal Test System is a precision-engineered solution for Environmental Stress Screening (ESS) and failure analysis. By simulating extreme temperature transitions, it actively precipitates latent defects in electronic components, PCBs, and materials—such as solder joint fatigue, material cracking, and chip delamination.
- •By adjusting the heating rate and temperature transition time, a temperature change from -40°C to +85°C can be achieved within 20 seconds.
- •The built-in air drying and filtration system delivers clean dry air (CDA) through its powerful internal cooler/heat exchanger, providing temperatures ranging from -70°C to +180°C.
- •The temperature systems are all designed as standalone units. Simply plug them in to immediately begin thermal testing of components. [No configuration required]
- •Equipment models with single and dual test areas.
Application Fields Of The Test Chamber
Thermal Test System simulating extreme temperature transitions, it actively precipitates latent defects in electronic components, PCBs, and materials—such as solder joint fatigue, material cracking, and chip delamination. This system delivers critical reliability verification and accelerated quality validation for the semiconductor, automotive electronics, and advanced manufacturing industries.
- •Semiconductor & Advanced Packaging: For Wafer-Level Reliability (WLR) testing, Thermo-Mechanical Stress Testing (TMST) of chip packages, and validation of warpage and interconnect reliability in 2.5D/3D packaging under temperature cycling.
- •Aerospace & Defense: Validates the performance retention of avionics computers, navigation systems, and military communication modules under rapid temperature transients, in compliance with MIL-STD-883/810.
- •Communications & Data Centers: Performs Highly Accelerated Life Testing (HALT/HASS) on 5G RF modules, optoelectronic devices, and server storage hardware to screen early-life failures and improve Mean Time Between Failures (MTBF).