Memory Burn-in Test System
SANWOOD Memory Burn-in Test System is specifically designed for reliability testing of semiconductor and electronic components. By precisely simulating extreme temperatures, it enables efficient batch aging screening of Burn-in Board. Featuring a highly uniform temperature field, rapid thermal response, and intelligent control, the equipment ensures consistent and repeatable test results, thereby enhancing the efficiency of product durability verification.
Memory Burn-in Test System
SANWOOD Memory Burn-in Test System performs rigorous temperature cycling on burn-in boards to screen early-life failures in ICs, memory modules, and SSDs. Compliant with JEDEC standards, it's essential for semiconductor reliability validation.
Advantages of Sanwood Test chamber
Sanwood Technology's Memory Burn-in Test System is specifically designed for high-low temperature aging tests on semiconductors, electronic components, and burn-in boards. It precisely simulates harsh temperature environments to ensure the reliability and stability of chips and modules prior to mass production.
- •Features high-power compressor units and efficient refrigeration systems to deliver rapid linear temperature change rates while effectively counteracting heat generated by burn-in boards, achieving precise temperature control under full-load power conditions.
- •Standard automatic electric doors enable one-touch operation with enhanced sealing, boosting efficiency while ensuring temperature field stability and personnel safety.
- •Customizable reinforced sliding-track racks are available based on client-specific BIB board and aging rack dimensions, offering high load capacity and flexible layout options.
Application Fields of The Test Chamber
SANWOOD Memory Burn-in Test System serves as a critical validation equipment for electronic product quality and reliability. Its core application involves conducting high-low temperature stress screening and performance evaluation under powered conditions for semiconductor devices and electronic modules mounted on dedicated burn-in boards (BIB).
- •Semiconductor and Integrated Circuit Industry: Chip Burn-in Screening: Subjects chips such as CPUs, GPUs, memory (DRAM, NAND Flash), and microcontrollers (MCUs) to high-temperature, high-voltage powered aging to preemptively eliminate early-failure products—a critical process for enhancing factory yield rates.
- •Automotive-Grade Reliability Verification: Strictly adhering to standards like AEC-Q100, we perform high/low-temperature cycling and high-temperature reverse bias (HTRB) tests on engine control units (ECUs), battery management systems (BMS), in-vehicle sensors, IGBT modules, and more to ensure absolute reliability under extreme conditions.
- •Server and Storage Device Validation: Tests the stability of server motherboards and storage drives under prolonged high loads and temperature variations.
The Test Standards Of The Test Chamber
Burn-in Board (Aging Board) Dedicated High-Low Temperature Test Chamber serves as the cornerstone for verifying electronic product quality and reliability, with its design and performance strictly adhering to international mainstream industry standards.
- •Semiconductor/IC: JEDEC (JESD22) - Industry-standard reliability foundation; AEC-Q100 - Mandatory certification for automotive chips.
- •Automotive Electronics: AEC-Q100/Q104 - Automotive chips and modules; ISO 16750 - General environmental testing requirements for vehicle manufacturers.
- •Communication Equipment: GR-468-CORE - Core reliability standard for optical components.
- •Military/Aerospace: MIL-STD-883 / GJB 548 - High-reliability and stringent testing methods for military products.